Underfill

Questions? Contact us!

Advanjet
926 S. Andreasen Dr. Ste 108
Escondido, CA 92029

Phone: (760)-294-3392

info@advanjet.com

Material Application
ASEC AN-3910 Flip Chip and CSP Underfill
Henkel FP 4531 Flip Chip and CSP Underfill
Hysol UF3808 Flip Chip and CSP Underfill
Hysol UF3810 Flip Chip and CSP Underfill
Loctite DC0114 Flip Chip and CSP Underfill
Loctite FP5201 Flip Chip and CSP Underfill
Namics U8410-302 Flip Chip and CSP Underfill
Namics U8443 Flip Chip and CSP Underfill

System Recommendations

Underfill and encapsulation epoxies are typically filled with hard particles. It is important to use components that are resistant to wear. There are only two components in contact with the fluid, the diaphragm and the nozzle, and both are easily replaced and require no special tools or down time of the jet. For best results, consider:

  • HV-2000 Diaphragm Jet with the HV-2000C Controller
  • HV-9500 Standalone Jet for integration on existing automation
  • Wear resistant 09-23XX Series Ceramic Nozzles
  • High Flex 09-2029-SN contoured FKM diaphragm with silicon nitride tip